COMMUNICATION NETWORKS MANUFACTURING
With decades experience with a broad range of communication networks products, Sanmina provides you with integrated design, technology and global supply chain solutions.
- Technology, design and manufacture of high speed optical and RF transceivers, PCBs, backplanes and enclosures.
- A unique combination of engineering, technology and manufacturing experience that makes us a trusted and valuable supply chain partner.
For decades, Sanmina has been collaborating with the world’s leading communications Original Equipment Manufacturers (OEMs) to design, manufacture, deliver and repair broadband routers, switches, wireless, wireline and advanced optical network infrastructure equipment.
Sanmina integrates its high-technology components into these products, which include high speed optical and RF transceivers, PCBs, backplanes and enclosures. Our combined experience with communications system components, systems and test engineering help optimize time to market, while maximizing performance, cost and system reliability.
Leading communications OEMs trust Sanmina to manufacture, test and repair complex 4G and 5G infrastructure equipment.
Sanmina develops custom RF and optical transceivers, modulators and subsystems for a broad range of communications products – but you own the IP.
Sanmina specializes in building high technology, complex PCBAs and Line Cards in state of the art facilities around the world.
Personal communications equipment used by first responders, medical personnel and police organizations is manufactured by Sanmina.
Sanmina simplifies supply chains and accelerates time to market for backhaul systems by providing integrated manufacturing solutions for complete systems, PCBAs, PCBs, cables, backplanes and enclosures.
Sanmina specializes in building, testing and repairing highly complex RF products, such as base station radios.
Sanmina’s component technologies improve equipment performance and reduce costs for communications and network equipment customers. We offer a complete and integrated set of technologies for high-performance communications products including optical and RF transceivers, PCBs, backplanes and enclosures. We have in-house labs for materials analysis and signal integrity to qualify the latest high-speed laminates for PCBs and backplanes, as well as thermal and RF emissions labs for enclosures. Our design centers are located close to our customers, with best-cost manufacturing in all major regions worldwide.
Customers can choose from a wide range of service offerings. This flexibility enables our customers to engage in the design and industrialization processes as much as or as little as they want while maintaining the product IP. All design services are performed with manufacturability and a robust supply chain in mind.
• Blind/Buried/Stacked via escape structures
• Multiple sequential lamination using hybrid material sets
• Embedded Passives
• Coin-in-Cavity Thermal Solutions
• Multiple depth back drilling
We offer design, DFX, prototype and volume production services for frames, racks and enclosures with hard and soft tooling, paint and powder coating.
We also have extensive experience with fan tray, cooling and power system design.
Design and Engineering
Customers benefit from Sanmina’s decades of design experience for telecommunications components and subsystems including indoor and outdoor enclosures, PCBs, backplanes, cables, RF and optical components.
Our design capabilities are integrated; we can provide design or thermal, EMC and seismic analysis for an integrated backplane/enclosure subassembly.
We have in-house labs for materials analysis and signal integrity to qualify the latest high-speed laminates for PCBs and backplanes, as well as thermal and RF emissions labs for enclosures.
• Via escape structures for fine pitch 3000+ pin BGAs
• Advanced laminate qualifications, supporting low attenuation at 25 Gbs
• Backplanes: Multiple materials and sequential laminations
• Layer counts to 50+, panel sizes to 60 inches, blind connectors, backdrilling