Design

Our in-house technical resources have years of experience with high speed backplane design, layout, mechanical and thermal design, signal integrity, power distribution and advanced connector selection.

Signal Integrity

Our technology and designs are optimized for signal integrity and take into account distributed interconnect parameters and subtle EM effects, ensuring low noise and high performance throughout the entire interconnect system.

Backplane Fabrication

Sanmina provides quick turn and production backplanes including: UL® ready hybrid constructions integrating FR4, low-loss laminates, blind and buried vias, PTH signal integrity optimization, buried capacitance®, thick-film resistors, and RoHS-compliant surface finishes.

Test

With 30 years of backplane test experience, we provide our customers with a complete test environment including production VNA testing, RoBAT, flying probe, automatic optical inspection (AOI), X-ray and Testronics test capability.

Global Footprint

Sanmina has high technology backplane fabrication and assembly facilities in North America, Mexico and Asia. Our facilities are compliant with key regulatory and safety standards including: ISO 9001, 14001, TL 9000, BABT, ETSI, GMP, UL, CSA, Mil-PRF-5110/31032 and Mil-A-28870.