Backplane Design, Manufacturing & Testing
For decades, Sanmina has been the technology leader for the world’s most advanced backplanes. Leading telecommunications and network equipment companies depend on Sanmina to incorporate the latest innovations in connectors, design, materials and process technology into high performance backplanes.
Sanmina has high technology backplane fabrication and assembly facilities in North America, Mexico and Asia. Our facilities are compliant with key regulatory and safety standards including: ISO 9001, 14001, TL 9000, BABT, ETSI, GMP, UL, CSA, Mil-PRF-5110/31032 and Mil-A-28870.
Our in-house technical team has decades of experience with high speed backplane design, layout, mechanical and thermal design, signal integrity, power distribution and advanced connector selection.
Signal Integrity Analysis
Our technology and designs are optimized for signal integrity and take into account distributed interconnect parameters and subtle EM effects, ensuring low noise and high performance throughout the entire interconnect system.
Backplane Fabrication & Assembly
Sanmina provides quick turn and production backplane assembly including: UL® ready hybrid constructions integrating FR4, low-loss laminates, blind and buried vias, PTH signal integrity optimization, buried capacitance®, thick-film resistors, and RoHS-compliant surface finishes. Our proven assembly methods accelerate time to market and simplify supply chains with integrated manufacturing solutions for OEMs across many industries.
With decades of backplane test experience, we provide our customers with a complete test environment including the complete RoBAT test equipment suite, VNA testing, flying probe, automatic optical inspection (AOI), X-ray and Testronics test capability.
Learn how Sanmina can bring your advanced backplanes to market. Contact us
PCB & Backplane Services