Advanced Backplanes

Technology leadership: design, signal integrity analysis, laminate qualification, backplane fabrication, assembly & test.

Backplane Assembly Manufacturing Expertise

Custom backplanes: 10/40/100 Gbps • Advanced Connector Expertise Quick-Turn Prototypes • High Volume Production


Signal Integrity & Materials Labs

Advanced technology development including latest laminates qualification; microwave & RF testing as well as time/frequency domain measurements.

State of the Art Test Solutions

Comprehensive test solution including production VNA testing, RoBAT, flying probe, AOI, X-ray and Testronics test capability.

Backplanes & Systems Complete Solutions

Power, thermal & seismic design; enclosure, frame & chassis design, optical & RF assemblies, system integration & functional test.

Backplane Design, Manufacturing & Testing

For decades, Sanmina has been the technology leader for the world’s most advanced backplanes. Leading telecommunications and network equipment companies depend on Sanmina to incorporate the latest innovations in connectors, design, materials and process technology into high performance backplanes.

Sanmina has high technology backplane fabrication and assembly facilities in North America, Mexico and Asia. Our facilities are compliant with key regulatory and safety standards including: ISO 9001, 14001, TL 9000, BABT, ETSI, GMP, UL, CSA, Mil-PRF-5110/31032 and Mil-A-28870.

Backplane Design

Our in-house technical team has decades of experience with high speed backplane design, layout, mechanical and thermal design, signal integrity, power distribution and advanced connector selection.

Signal Integrity Analysis

Our technology and designs are optimized for signal integrity and take into account distributed interconnect parameters and subtle EM effects, ensuring low noise and high performance throughout the entire interconnect system.

Backplane Fabrication & Assembly

Sanmina provides quick turn and production backplane assembly including: UL® ready hybrid constructions integrating FR4, low-loss laminates, blind and buried vias, PTH signal integrity optimization, buried capacitance®, thick-film resistors, and RoHS-compliant surface finishes. Our proven assembly methods accelerate time to market and simplify supply chains with integrated manufacturing solutions for OEMs across many industries.


With decades of backplane test experience, we provide our customers with a complete test environment including the complete RoBAT test equipment suite, VNA testing, flying probe, automatic optical inspection (AOI), X-ray and Testronics test capability.

Learn how Sanmina can bring your advanced backplanes to market. Contact us

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Backplane Solution

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PCB & Backplane Services

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