BACKPLANES
Manufacturing CapabilitiesLarge format backpanel technology:
|
Attribute |
Complexity |
||
|
|
Standard |
High |
Advanced |
| Layer Count (Max. Layers) | 30 | 60 | 62+ |
| PCB Size (Max.) | 21″ x 27″ | 22″ x 34″ | 28″ x 42″ |
| Thickness (Max.) | 0.225″ | 0.400″ | > 0.400″ |
| Materials | FR-4 (Dk>4.2) 2 mil BC® | 3.7< Dk< 4.2 1 mil BC® | 3.0< Dk< 3.6 1 mil BC® |
| Inner Layer Line Width/Space | 0.005″/0.005″ | 0.004″/0.004″ | 0.003″/0.0035″ |
| Outer Layer Line Width/Space | 0.006″/0.006″ | 0.005″/0.005″ | 0.004″/0.004″ |
| Impedance (SE or DIFF) | 10% | 7% | 5% |
| Through Hole Aspect Ratio | 14:1 | 17:1 | 20:1 |
| Drill Registration (no AR) | Drill + 0.010″ | Drill + 0.009″ | Drill + 0.008″ |
| Blind Vias | Layers n to n-1 | Layers n to n-2 | >Layers n to n-2 |
| Buried Vias | No | Yes | Yes |
| Sequential Lamination | No | Yes | Yes |
| Component Type/Pitch | 1.0mm BGA | 0.8mm BGA | 0.65mm BGA |
