BACKPLANES

Manufacturing Capabilities

Large format backpanel technology:

Attribute  Complexity
Standard High Advanced
Layer Count, Maximum 36 60 >60
Panel Size, Maximum 21″ x 27″ 24″ x 36″ 28″ x 42″
Thickness, Maximum 0.225″ 0.400″ >0.400″
Inner Layer Line Width / Space .004″/.004″ .003″/.003″ <.003″/.003″
Outer Layer Line Width / Space .005″/.005″ .004″/.004″ <.004″/.004″
Impedance Tolerance (SE or Diff) 10% 7% 5%
Through Hole Aspect Ratio 20:1 30:1 >30:1
Drill Registration (no AR). Panel Size Dependent Drill + 12 Drill + 11 Drill + 10
Blind Vias n to n-1 n to n-2 >n to n-2
Buried Vias No Yes Yes
Sequential Lamination No Yes, < 6 cycles Yes, > 6 cycles