Surface Mount Technology Advancements in 2015
Sanmina’s VP of Process Technology Development, Mulugeta Abtew, reviews the latest surface mount technology advances for 2014 and 2015, based on increasing signal transmission speeds and device pin counts.
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The Relationship between Backward Compatible Assembly & Microstructure on the Thermal Fatigue Reliability of an Extremely Large BGA (3162 balls)
By studying the effects of mixed alloy solders on reliability, this paper highlights the importance of resolving solder joint quality issues before beginning mixed alloy assembly on large BGA packages.
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EDA Café DesignCon Interview
In this video interview Brian Nelson delves into the latest technology advancements in high speed backplanes.
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The Effect of Lead Mixing Levels on Solder Joint Reliability in High-Density BGA
Switching to a completely, lead-free manufacturing process remains a challenge for many high-reliability, electronics companies. Published in SMTA International Conference Proceedings, this paper explores the effects of mixed alloy processing on solder joint reliability.
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