SCI provides Integrated Manufacturing Services (IMS), an evolution of service consolidating unmatched capabilities and comprehensive solutions tailored to each customer’s discrete needs.


SCI’s Integrated Manufacturing Services include:

  • Printed Circuit Board Assembly (PCBA) or Circuit Card Assembly (CCA) Manufacturing Technologies
  • Ball Grid Array (BGA) and Micro BGA
  • Box Build Assembly Lines
  • Surface-Mount Technology
  • Pin-Through-Hole Technology
  • Multiple Configuration Capabilities
  • Prototyping
  • Aqueous Clean and No-Clean
  • In-Circuit & Functional-Test Development
  • Testing for PCBA
  • Flying Probe, In-Circuit-Test, Functional Test
  • AOI, Hi-Pot
  • Environmental Stress Screening (ESS), Highly Accelerated Life Testing
  • Testing for Box Build
  • Functional Test
  • Burn-In
  • RoHS [Reduction Of Hazardous Substances] and Leaded Processes Design for eXcellence (DFx)
  • Depot/Logistics/Sustainment
  • Order Fulfillment
  • Full Product Lifecycle
  • Quality
  • Ruggedization to Include Automated/Robotic
  • Flex and Rigid Flex Assembly
  • Highly Accelerated Life Test/Highly Accelerated Stress Screening:
    –  HALT/HASS
  • Conformal coat
  • –  Coating and Plastics facility
    –  Machine Spray Coating and Curing
  • –  Hand Coating and Curing
  • –  Parylene Coating
  • Lamination
  • Plastics
  • Logistics
  • Build-to-Order (BTO)
  • Configure-to-Order (CTO)
  • Built to Stock, Ship to Customer Orders (BTS)
  • Customer Direct Fulfillment
  • Warehousing, Vendor Managed Inventory (VMI)
  • High volume Repair Center, Parts Hotline
  • High Quality Repair Center
  • Design and Engineering Services
  • Maintenance
  • Refurbishment and Repair of Products