SANMINA TECHNOLOGY

Optical & RF Components • Printed Circuit Boards • Enclosures

Consumer Medical Devices

Optical and RF Components

Sanmina designs and produces state-of-the-art optical and RF transceivers, modulators, amplifiers and other components.

Our customers retain the design IP, while Sanmina develops modules and subsystems incorporating the latest microelectronic packaging and substrate technology.

We offer customers complete services, including turnkey test system development for RF and optical systems.

Ultrasound

Printed Circuit Boards

We partner with customers to develop custom, high-speed PCBs that deliver the highest performance in the industry using the latest technologies and materials, qualified in-house by Sanmina. Recent PCB innovations include:

  • Blind/Buried/Stacked Via Escape Structures for Fine Pitch 3000+ Pin BGAs
  • Multiple Sequential Laminations of Multiple Materials
  • Castellated Slots for Direct Soldering of High-Speed Daughter Boards
  • Embedded Passives
  • Coin-in-Cavity Thermal Solutions
  • Back Drilled Holes and much more
Patient Monitoring

Enclosures

Customers benefit from Sanmina’s complete mechanical, thermal, and RF emissions design expertise for communications enclosure design, prototyping and production.

We offer design, DFX, prototype and volume production services for frames, racks and enclosures with hard and soft tooling, paint and powder coating.

Once the design is approved, Sanmina manages the transfer of manufacturing in order to provide the best total landed cost.

We also have extensive experience with fan tray, cooling and power system design.

Sanmina’s component technologies improve equipment performance and reduce costs for communications and network equipment customers. We offer a complete and integrated set of technologies for high-performance communications products including optical and RF transceivers, PCBs, backplanes and enclosures. We have in-house labs for materials analysis and signal integrity to qualify the latest high-speed laminates for PCBs and backplanes, as well as thermal and RF emissions labs for enclosures. Our design centers are located close to our customers, with best-cost manufacturing in all major regions worldwide.

Show Buttons
Hide Buttons