Vertically Integrated Wafer-to-Optical Systems Manufacturing
Accelerating 1.6T and CPO from Prototype to Turnkey Volume
Standard packaging methods hit thermal, RF, and physical density limits at next-generation speeds. Advanced Microsystems Technologies (A Sanmina Division) bypasses these barriers by merging microelectronic, optical, and RF design directly with volume manufacturing. We integrate bare die into MCM, SiP, Chip-on-Board, and CPO formats to scale complex silicon photonics from proof-of-concept to global hyperscale volume without re-engineering.
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1.6T High-Density Transceiver Platform
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Advanced Packaging and Integration
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JDM Design and Development
Schedule a 30-Minute Conversation
Eric Sislian
GM & VP, Business Development and Strategy
Mike Newhouse
Product Development, Vice President of Engineering
Sid Sircar
Sr. Director of Optical Business Development
Cindy Snyder
Sr. Business Development Manager
1.6T HIGH-DENSITY
TRANSCEIVER PLATFORM
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SiPh with Integrated Lasers Delivering Reliability and Power Efficiency
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Simplified Architecture Maximizing Performance and Streamlining Assembly
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Scale Out/Up Roadmap to 3.2T and Next-Gen Evolution
ADVANCED PACKAGING
AND INTEGRATION
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Volume FlipChip and Chip-On-Board Capacity
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Free Space and Guided Optical Assembly at Scale
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Heterogeneous Integration of Bare Die, MCM, SiP, CPO
JDM DESIGN
AND DEVELOPMENT
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Micro-Electronic, Optical, and RF Expertise
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Proof-of-Concept to Turnkey Volume Manufacturing
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Co-Located Design, Development, and Production
end-to-end cloud and ai infrastructure solutions
Validated Performance Across Multiple Industries
CLOUD AND AI DATA CENTERS
AUTOMOTIVE ELECTRONICS
COMMUNICATIONS NETWORKS
MEDICAL SYSTEMS
DEFENSE AND AEROSPACE
INDUSTRIAL SYSTEMS
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