The Benchmark for 224G Reality and Global Scale
Ruggedized Defense Backplanes.
High-Speed 224G mSAP Interconnects.
Standard fabrication physics is no longer sufficient for critical infrastructure. 224G signal integrity demands vertical sidewalls and 2 mil precision. We deliver the 90+ layer reliability required for defense, aerospace, hyperscale computing, medical, automotive, and networking systems. Visit Sanmina at Booth 507 to inspect flight-ready hardware as the benchmark for your specific medical, automotive, or industrial reliability requirements. We provide the engineering reality for extreme complexity and next-generation speed.
mSAP Additive Processing:
2 mil line / 2 mil space for
0.3mm pitch
Mission-Critical Complexity:
>90 Layer counts and
400 mil thickness
Secure Domestic Fabrication:
ITAR and AS9100 certified in San Jose and Costa Mesa
Global Volume Scale:
Automated high-density production in Singapore and Wuxi
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Domestic Security. Global Scale.
A Segmented Strategy for NPI and Volume Production.
USA
San Jose & Costa Mesa
Mission: IP Security and High-Mix Complexity.
Focus: ITAR, EAR, Defense, and Flex/Rigid-Flex architectures.
Asia
Singapore & Wuxi
Mission: Automated Precision and Hyperscale Volume.
Focus: Advanced HDI, Automotive Reliability, and high-speed computing.
Validated Performance Across Critical Sectors
DEFENSE & AEROSPACE
Ruggedized Precision
AS9100 certified reliability for mission-critical backplanes and radar systems.
MEDICAL & INDUSTRIAL
Lifecycle Reliability
ISO 13485 fabrication for diagnostic imaging and surgical robotics.
HYPERSCALE & CLOUD
The Speed of AI
224G interconnects and thermal management for next-gen compute nodes.
AUTOMOTIVE & EV
Power & Sensing
Heavy copper (>6 oz) and high-frequency laminates for ADAS and electrification.
NETWORKING & 5G
Signal Integrity
High-speed switch fabrication with optimized optical backdrilling.
SEMICONDUCTOR & OPTICAL
Reference Standards
Advanced fabrication for ATE, probe cards, and chip reference designs.
