Manufacturing Complex Rack-Level Solutions for Advanced Ai Workloads
Building Next-Gen Heterogeneous AI Compute
Accelerating Time to Market as a Preferred NPI Partner for AMD Cloud and AI Solutions. Delivering Cluster-Scale Mass Production, Validation, and Global Fulfillment. Supporting TensorWave with Dedicated Server and Rack Level Infrastructure.
-
1.6T High-Density Transceiver Platform
-
Advanced Packaging and Integration
-
JDM Design and Development
End-to-end Vertical Integration for Cloud and AI Infrastructure
Schedule a 30-Minute Conversation
Eric Sislian
GM & VP, Business Development and Strategy
Mike Newhouse
Product Development, Vice President of Engineering
Sid Sircar
Sr. Director of Optical Business Development
Cindy Snyder
Sr. Business Development Manager
1.6T HIGH-DENSITY
TRANSCEIVER PLATFORM
-
SiPh with Integrated Lasers Delivering Reliability and Power Efficiency
-
Simplified Architecture Maximizing Performance and Streamlining Assembly
-
Scale Out/Up Roadmap to 3.2T and Next-Gen Evolution
ADVANCED PACKAGING
AND INTEGRATION
-
Volume FlipChip and Chip-On-Board Capacity
-
Free Space and Guided Optical Assembly at Scale
-
Heterogeneous Integration of Bare Die, MCM, SiP, CPO
JDM DESIGN
AND DEVELOPMENT
-
Micro-Electronic, Optical, and RF Expertise
-
Proof-of-Concept to Turnkey Volume Manufacturing
-
Co-Located Design, Development, and Production
end-to-end cloud and ai infrastructure solutions
Validated Performance Across Multiple Industries
CLOUD AND AI DATA CENTERS
AUTOMOTIVE ELECTRONICS
COMMUNICATIONS NETWORKS
MEDICAL SYSTEMS
DEFENSE AND AEROSPACE
INDUSTRIAL SYSTEMS
Contact Us
End-to-end Vertical Integration for Cloud and AI Infrastructure
Building Next-Gen Heterogeneous AI Compute
Accelerating Time to Market as a Preferred NPI Partner for AMD Cloud and AI Solutions. Delivering Cluster-Scale Mass Production, Validation, and Global Fulfillment. Supporting TensorWave with Dedicated Server and Rack Level Infrastructure.
-
1.6T High-Density Transceiver Platform
-
Advanced Packaging and Integration
-
JDM Design and Development
End-to-end Vertical Integration for Cloud and AI Infrastructure
Schedule a 30-Minute Conversation
Eric Sislian
GM & VP, Business Development and Strategy
Mike Newhouse
Product Development, Vice President of Engineering
Sid Sircar
Sr. Director of Optical Business Development
Cindy Snyder
Sr. Business Development Manager
1.6T HIGH-DENSITY
TRANSCEIVER PLATFORM
-
SiPh with Integrated Lasers Delivering Reliability and Power Efficiency
-
Simplified Architecture Maximizing Performance and Streamlining Assembly
-
Scale Out/Up Roadmap to 3.2T and Next-Gen Evolution
ADVANCED PACKAGING
AND INTEGRATION
-
Volume FlipChip and Chip-On-Board Capacity
-
Free Space and Guided Optical Assembly at Scale
-
Heterogeneous Integration of Bare Die, MCM, SiP, CPO
JDM DESIGN
AND DEVELOPMENT
-
Micro-Electronic, Optical, and RF Expertise
-
Proof-of-Concept to Turnkey Volume Manufacturing
-
Co-Located Design, Development, and Production
end-to-end cloud and ai infrastructure solutions
Validated Performance Across Multiple Industries
CLOUD AND AI DATA CENTERS
AUTOMOTIVE ELECTRONICS
COMMUNICATIONS NETWORKS
MEDICAL SYSTEMS
DEFENSE AND AEROSPACE
