Sanmina at AMD Advancing AI 2026
Building
The Future
Join Sanmina at AMD Advancing AI 2026 in booth #915 at Moscone West, July 22 and 23 in San Francisco to learn more. Our hardware engineering and manufacturing roundtable, From Silicon to Systems, is on July 23 from 2:00 PM – 2:45 PM on Level 2 in room 2012.
— From Silicon to Systems
Hardware Engineering &
Manufacturing Roundtable
High-density AI clusters introduce complex physical layer bottlenecks long before hardware reaches the data center floor. This interactive roundtable brings together platform architects, manufacturing leaders, and deployment experts to address the practical engineering path required to transform raw AMD layouts into validated, rack-scale compute environments.
HARDWARE ENGINEERING AND MANUFACTURING ROUNDTABLE
July 23 · 2:00 PM – 2:45 PM
Level 2, 2012
Session #S-103
— End-to-End Solutions
Production
Defined by Precision
Complex physical infrastructure requires deep operational continuity across every sub-system. We execute the entire hardware stack, ensuring complete engineering alignment, optimized performance, and long-term field reliability.
SANMINA
From initial prototype to full-scale production, Sanmina builds the mission-grade systems and highly complex infrastructure that run the world. Our vertically integrated manufacturing network spans 20 countries and 3 continents, delivering with speed, quality,
and scale.
Full System Architecture
Hi-Tech PCBs
Board Assembly & Test
Racks & Enclosures [OCP or Custom]
Liquid Cooling
Cooling Manifolds
Busbars
Compute & Storage Systems [ODM & JDM]
Custom Memory
Custom Optical Modules
Full Systems Integration
Global Fulfillment Services
Define performance, scalability, and interoperability across complex platforms.
Fabricate advanced designs with precision, consistency, and high-reliability materials.
Deliver precision builds and rigorous validation to ensure consistent quality.
Design and build tailored infrastructure for performance, density, and deployment efficiency.
Engineering high-efficiency thermal approaches for demanding, high-density environments.
Develop custom power distribution approaches for high-current, high-density environments.
Design and build platforms aligned to specific performance and workload demands.
Develop tailored configurations optimized for performance, capacity, and reliability.
Develop tailored configurations optimized for performance, capacity, and reliability.
Design and manufacture high-speed components for reliable data transmission.
Integrate complex builds into fully validated, production-ready platforms.
Execute worldwide logistics and deployment with speed, scale, and precision.
Full System Architecture
Define performance, scalability, and interoperability across complex platforms.
Hi-Tech PCBs
Fabricate advanced designs with precision, consistency, and high-reliability materials.
Board Assembly & Test
Deliver precision builds and rigorous validation to ensure consistent quality.
Racks & Enclosures [OCP or Custom]
Design and build tailored infrastructure for performance, density, and deployment efficiency.
Liquid Cooling
Engineering high-efficiency thermal approaches for demanding, high-density environments.
Cooling Manifolds
Develop custom power distribution approaches for high-current, high-density environments.
Busbars
Design and build platforms aligned to specific performance and workload demands.
Compute & Storage Systems [ODM & JDM]
Develop tailored configurations optimized for performance, capacity, and reliability.
Custom Memory
Develop custom power distribution approaches for high-current, high-density environments.
Custom Optical Modules
Design and manufacture high-speed components for reliable data transmission.
Full Systems Integration
Integrate complex builds into fully validated, production-ready platforms.
Global Fulfillment Services
Execute worldwide logistics and deployment with speed, scale, and precision.
— Speed · Quality · Scale
Technical
Capabilities
Purpose-built to solve complex product challenges, our deep engineering expertise enables the development of highly-specialized solutions with precision, control, and repeatability.
Hyperscale AI & Storage Solutions
Infrastructure specifically designed for data-intensive workloads, enabling high-performance compute, accelerated AI training, and scalable storage architectures.
Thermal Management & Critical Power Systems
Engineered to sustain peak performance under extreme load and ensure reliability across mission-critical environments.
High-Density Interconnect & PCB Fabrication
High velocity 224G performance through proprietary mSAP additive processing that handles the complexity of 90+ layer constructions, optical back-drilling, and more.
Semiconductor Packaging & Photonics Integration
High-precision assembly, heterogeneous integration, and optical technologies support faster data transfer and lower latency to support next-generation compute.
Electro-Mechanical Systems Integration
Combined precision mechanics, electronics, and system-level design deliver fully integrated solutions, optimized for demanding applications and environments.
Mechatronics & Precision Machining
Engineered for tight tolerances and high-performance applications, advanced automation, motion control, and multi-axis machining drive the production of complex components and assemblies.
Automation & Digital Manufacturing
Tech-driven manufacturing environments designed to streamline production and enable consistent, high-quality output through advanced automation, data integration, and real-time process control.
Advanced Hardware Solutions
Sanmina turns critical hardware challenges into market-ready solutions. Powered by deep engineering expertise and seamless global execution, we deliver the speed, quality, and precision your next breakthrough demands.
— Locations
Global
Footprint
Spanning 20 countries and 3 continents, built over decades of organic growth and strategic acquisition.
Cloud & Ai
Microelectronics | Optical | RF | PCB
Backplanes | Cable Assemblies | Enclosures
Precision Machining | Plastic Injection Molding
Components Technology
Microelectronics | Optical | RF | PCB
Backplanes | Cable Assemblies | Enclosures
Precision Machining | Plastic Injection Molding
Integrated Manufacturing Services
Microelectronics | Optical | RF | PCB
Backplanes | Cable Assemblies | Enclosures
Precision Machining | Plastic Injection Molding
Design & Engineering Services
Microelectronics | Optical | RF | PCB
Backplanes | Cable Assemblies | Enclosures
Precision Machining | Plastic Injection Molding
Global Services
Microelectronics | Optical | RF | PCB
Backplanes | Cable Assemblies | Enclosures
Precision Machining | Plastic Injection Molding
