HIGH TECHNOLOGY INTERCONNECT SOLUTIONS

ADVANCED PCBS. BACKPLANES AND FLEX CIRCUITS FOR ALL INDUSTRIES, WITH A FOCUS ON HIGH SPEED TECHNOLOGIES FOR TELECOM.

 

High Speed Printed Circuit Boards

  • Multipule Sequential Laminations
  • HDI, Any Layer Structures
  • Over 70 Layers
  • Thermal Coining and Laser Milling
  • Blind and Backdrilled Thru Holes

High Speed Backplanes

  • Panel Sizes to 54 Inches
  • Over 70 Layers
  • Blind and Backdrilled Thru Holes
  • Dual Diameter Holes
  • Heavy Copper Layers and Connector Expertise

Fully Integrated High Speed Solutions

Sanmina provides a fully integrated high speed capability, with in house design, simulation, signal integrity, EMC/RFI analysis, prototyping and production of custom backplanes, high speed printed circuit boards cables and enclosures.

 

Mission Critical Printed Circuit Boards

Sanmina designs and produces high reliability PCBs and flex circuits. Certifications include:

  • MIL-PRF-55110 &31032
  • ITAR Certification
  • AS-9100, TL 9000 and Telcordia GR-78-CORE

 

 

Global Locations PCBs and Flex Circuits

Providing local, regional and global services for advanced printed circuit boards and flex circuits, including technology development, quick turns and volume production.

 

Services PCBs and Flex Circuits

Sanmina provides customers with 30 years of experience in PCB design, rules checking, signal integrity and the qualification of advanced laminates.

Technologies Engineering Leadership

Sanmina is the recognized leader in technology and process engineering; from the qualification of the latest laminate materials, to sequential lamination, high aspect ratio, any layer via structures and fine line PCBs.

From the in house qualification of advanced laminate materials, signal integrity analysis, DFx and global manufacturing, Sanmina is the recognized leading manufacturer of advanced printed circuit boards. For both high speed and high reliability PCB fabrication, Sanmina will work with you to develop advanced PCBs with unique requirements.

  • PCB Layout, CAD, Design for Manufacturability and Cost (DFx)
  • Quick-turn PCB Prototyping for High Technology PCBs, Backplanes and Flex Circuits
  • High-volume, Global Manufacturing in the Americas and Asia
  • Advanced Technology: Latest Laminates, HDI, any Layer Via Structures, Multiple Sequential Laminations

SERVICES

PCB services

TECHNOLOGY

LOCATIONS

CASE STUDIES

RESOURCES

BACKPLANES

Complete High Speed PCB & Backplane Solutions

Sanmina provides a fully integrated high speed capability, with in house design, simulation, signal integrity, EMC/RFI analysis, prototyping and production of custom backplanes, high speed PCBs, cables and enclosures.

Mission Critical PCB Solutions

Sanmina designs and produces high reliability PCBs and flex circuits for defense and aerospace, medical and robust environments. Certifications include: MIL-PRF55110 & 31032, ITAR, AS-9100, TL 9000, Telecordia GR-78-CORE.

High Speed PCBs:

  • Multiple sequential laminations
  • HDI, any layer structures
  • Over 70 layers
  • Thermal coining
  • Laser milling
  • Blind and backdrilled thru holes

High Speed Backplanes:

  • Panel sizes to 54 inches
  • Over 70 layers
  • Blind and backdrilled thru holes
  • Dual diameter holes
  • Heavy copper layers
  • Connector expertise

CONTACT US

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