TECHNOLOGY LEADERSHIPS: BACKPLANES & BACKPLANE ASSEMBLY
Backplane Assembly Manufacturing Expertise
- Custom backplanes: 10/40/100Gbps
- Design, layout and CAD services
- Expertise with advanced connectors
- Performance/cost design analysis
- Quick-turn prototypes
- High volume production
Process & Technology Signal Integrity & Materials Labs
Materials & signal integrity labs for advanced technology development and testing:
- Microwave & RF testing
- Qualification of latest laminates
- Time/frequency domain measurements
- Available production VNA test
Manufacturing Test Automation Solutions
Comprehensive testing capabilities ensure quality & noise performance:
- Any type of backplanes & connectors
- Single or double-sided boards
- Simultaneous AOI and Electrical Tests
- HIPOT, EEPROM programming
- Virtually fixtureless – low NRE cost
Backplanes & Systems Complete Solutions
More than just a backplane manufacturer, Sanmina provides complete high speed system solutions:
- Power, thermal, seismic design
- Enclosure, frame and chassis design
- Optical & RF cable assemblies
- System integration
- End-to-end system testing
CUSTOM BACKPLANE SYSTEM SOLUTIONS
For over 30 years, Sanmina has been the technology leader for the worlds most advanced backplanes. Leading telecommunications and network equipment companies depend on Sanmina to incorporate the latest innovations in connectors, design, materials and process technology into high performance backplanes.
Our in-house technical resources have years of experience with high speed backplane design, layout, mechanical and thermal design, signal integrity, power distribution and advanced connector selection.
Our technology and designs are optimized for signal integrity and take into account distributed interconnect parameters and subtle EM effects, ensuring low noise and high performance throughout the entire interconnect system.
Sanmina provides quick turn and production backplanes including: UL® ready hybrid constructions integrating FR4, low-loss laminates, blind and buried vias, PTH signal integrity optimization, buried capacitance ®, thick-film resistors, and RoHS-compliant surface finishes.
With 30 years of backplane test experience, we provide our customers with a complete test environment including production VNA testing, RoBAT, flying probe, automatic optical inspection (AOI), X-ray and Testronics test capability.
Sanmina has high technology backplane fabrication and assembly facilities in North America, Mexico and Asia. Our facilities are compliant with key regulatory and safety standards including: ISO9001:2000, 14001, TL9000, BABT, ETSI, GMP, UL, CSA, Mil-PRF-5110/31032 and Mil-A-28870.
With smaller feature sizes and faster signal speeds; embedded passives are becoming more cost-effective.
Dk and Df Studies for Advanced Signal Integrity
Dicy-Cured FR-4 Materials Compared to Phenolic-Cured Materials
Opti-Via Technology for Improved Signal Integrity at High Frequencies
Opti-Via is a family engineered via structures whose S-parameters have been optimized for high-frequency applications.