ADVANCED BACKPLANES

TECHNOLOGY LEADERSHIPS: BACKPLANES & BACKPLANE ASSEMBLY

 

Backplane Assembly Manufacturing Expertise

  • Custom backplanes: 10/40/100Gbps
  • Design, layout and CAD services
  • Expertise with advanced connectors
  • Performance/cost design analysis
  • Quick-turn prototypes
  • High volume production

Process & Technology Signal Integrity & Materials Labs

Materials & signal integrity labs for advanced technology development and testing:

  • Microwave & RF testing
  • Qualification of latest laminates
  • Time/frequency domain measurements
  • Available production VNA test

Manufacturing Test Automation Solutions

Comprehensive testing capabilities ensure quality & noise performance:

  • Any type of backplanes & connectors
  • Single or double-sided boards
  • Simultaneous AOI and Electrical Tests
  • HIPOT, EEPROM programming
  • Virtually fixtureless – low NRE cost

Backplanes & Systems Complete Solutions

More than just a backplane manufacturer, Sanmina provides complete high speed system solutions:

  • Power, thermal, seismic design
  • Enclosure, frame and chassis design
  • Optical & RF cable assemblies
  • System integration
  • End-to-end system testing

CUSTOM BACKPLANE SYSTEM SOLUTIONS

For over 30 years, Sanmina has been the technology leader for the worlds most advanced backplanes. Leading telecommunications and network equipment companies depend on Sanmina to incorporate the latest innovations in connectors, design, materials and process technology into high performance backplanes.

 

Design

Our in-house technical resources have years of experience with high speed backplane design, layout, mechanical and thermal design, signal integrity, power distribution and advanced connector selection.

Signal Integrity

Our technology and designs are optimized for signal integrity and take into account distributed interconnect parameters and subtle EM effects, ensuring low noise and high performance throughout the entire interconnect system.

Backplane Fabrication

Sanmina provides quick turn and production backplanes including: UL® ready hybrid constructions integrating FR4, low-loss laminates, blind and buried vias, PTH signal integrity optimization, buried capacitance ®, thick-film resistors, and RoHS-compliant surface finishes.

Test

With 30 years of backplane test experience, we provide our customers with a complete test environment including production VNA testing, RoBAT, flying probe, automatic optical inspection (AOI), X-ray and Testronics test capability.

Global Footprint

Sanmina has high technology backplane fabrication and assembly facilities in North America, Mexico and Asia. Our facilities are compliant with key regulatory and safety standards including: ISO9001:2000, 14001, TL9000, BABT, ETSI, GMP, UL, CSA, Mil-PRF-5110/31032 and Mil-A-28870.

White Papers

Buried Capacitance®

 

With smaller feature sizes and faster signal speeds; embedded passives are becoming more cost-effective.

Dk and Df Studies for Advanced Signal Integrity

Dicy-Cured FR-4 Materials Compared to Phenolic-Cured Materials

Opti-Via Technology for Improved Signal Integrity at High Frequencies

Opti-Via is a family engineered via structures whose S-parameters have been optimized for high-frequency applications.

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