For over 30 years, Sanmina has been the technology leader for the worlds most advanced backplanes. Leading telecommunications and network equipment companies depend on Sanmina to incorporate the latest innovations in connectors, design, materials and process technology into high performance backplanes.
Our in-house technical resources have years of experience with high speed backplane design, layout, mechanical and thermal design, signal integrity, power distribution and advanced connector selection.
Our technology and designs are optimized for signal integrity and take into account distributed interconnect parameters and subtle EM effects, ensuring low noise and high performance throughout the entire interconnect system.
Sanmina provides quick turn and production backplanes including: UL® ready hybrid constructions integrating FR4, low-loss laminates, blind and buried vias, PTH signal integrity optimization, buried capacitance ®, thick-film resistors, and RoHS-compliant surface finishes.
With 30 years of backplane test experience, we provide our customers with a complete test environment including production VNA testing, RoBAT, flying probe, automatic optical inspection (AOI), X-ray and Testronics test capability.
Sanmina has high technology backplane fabrication and assembly facilities in North America, Mexico and Asia. Our facilities are compliant with key regulatory and safety standards including: ISO9001:2000, 14001, TL9000, BABT, ETSI, GMP, UL, CSA, Mil-PRF-5110/31032 and Mil-A-28870.
With smaller feature sizes and faster signal speeds; embedded passives are becoming more cost-effective.
Dk and Df Studies for Advanced Signal Integrity
Dicy-Cured FR-4 Materials Compared to Phenolic-Cured Materials
Opti-Via Technology for Improved Signal Integrity at High Frequencies
Opti-Via is a family engineered via structures whose S-parameters have been optimized for high-frequency applications.
Buried Capacitance’s Laminate List