INNOVATIVE CUSTOM BACKPLANES
Innovation is one of the core reasons why customers select Sanmina-SCI backplane products and services. As one of the world’s largest manufacturers of high-technology backplanes, we have significant experience designing, manufacturing and testing backplanes.
We offer industry-proven manufacturing, supply chain and engineering solutions, having helped thousands of companies increase their competitive position in a diverse set of end markets. Offering a vertically integrated business model is yet another advantage for our customers.
Below are some of our key innovations and technology drivers proven to save time, cost and defect rates.
Buried Capacitance®
Smaller feature sizes and faster signal speeds; embedded passives are becoming more cost-effective.
Smaller feature sizes and faster signal speeds; embedded passives are becoming more cost-effective.
Dk and Df Studies for Advanced Signal Integrity
Dielectric constants (Dk) and dissipation factors (Df); it’s critical to use a single scaling system.
Dielectric constants (Dk) and dissipation factors (Df); it’s critical to use a single scaling system.
Dicy-Cured FR-4 Materials Compared to Phenolic-Cured Materials
Dicy-cured FR-4 materials have been used for decades to mount electrical components to PCBs.
Dicy-cured FR-4 materials have been used for decades to mount electrical components to PCBs.
Opti-Vias’ Technology for Improved Signal Integrity at High Frequencies
Opti-Vias’ are a family engineered via structures whose S-parameters have been optimized for high-frequency applications.
Opti-Vias’ are a family engineered via structures whose S-parameters have been optimized for high-frequency applications.
Backdrilling and Blind Via Formation
Backplanes and other thick-format boards can endure significant signal integrity (SI) disturbances.
Backplanes and other thick-format boards can endure significant signal integrity (SI) disturbances.
Buried Capacitance’s Laminator List
