Sanmina-SCI is focused on driving operational excellence throughout all of our global facilities. Our solid manufacturing infrastructure and leading-edge capabilities enable us to design, manufacture and deliver electronics products and components into virtually every major marketplace in the world.
Whether a customer needs local, regional or global manufacturing solutions and support, we help them reduce new market risks with enhanced product quality, decreased time-to-market and improved customer satisfaction.
Our global backplane assembly facilities support regional and lower-cost manufacturing customer requirements.
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San Jose, California
Our San Jose, California, backplane facility offers a comprehensive suite of backplane services from NPI, test engineering and DFx, to assembly chassis-level system integration. Download the Facility Focus sheet to learn more. |
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Guadalajara, Mexico
Experience the responsiveness, pricing and quick turnaround times of one of the premier backplane manufacturing facilities in North America. Our Guadalajara, Mexico, backplane facility offers all the services customers require from concept to delivery. Download the Facility Focus sheet to learn more. |
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Kunshan, China
Our Kunshan, China, backplane facility specializes in backplane assembly and systems integration, providing customers a lower-cost Asian manufacturing solution for high-technology requirements. Download the Facility Focus sheet to learn more. |
Product Complexity – San Jose, Guadalajara and Kunshan Facilities.
| COMPLEXITY LEVEL | CAPABILITIES | ||
| Form Factor | Sizes up to 22" X 44" SMT and up to 36" X 48" Press-fit Area | ||
| SMT Placement | Thicknesses Greater than .500, SMT Tooling Required | ||
| Overall Component Placement | Double Sided | ||
| High I/O Package | BGA >= 500 I/O | ||
| Micro BGA/CSP | Yes | ||
| High Density SMT Connector | SMT + PTH Mictor >200 I/O | ||
| High Density Press-fit Connector | 2mm and High Speed Connectors | ||
| Connector Location | Back to Back / Common Mode Connection | ||
| BGA Placement | Double Sided | ||
| Active Device Placement | Double Sided | ||
| Chip Packages | 0402 | ||
| QFP/TSOP | 16 mil Pitch | ||
| Type of Soldered Components | Wave/Paste One and Two Sided | ||
| Parametric Test | RF Parametric Test / Calibration | ||
| Functional Test | As Required by Customer |
