Large format backpanel technology:
Attribute  Complexity
Standard High Advanced
Layer Count (Max. Layers) 30 60 62+
PCB Size (Max.) 21″ x 27″ 22″ x 34″ 28″ x 42″
Thickness (Max.) 0.225″ 0.400″ > 0.400″
Materials FR-4 (Dk>4.2) 2 mil BC® 3.7< Dk< 4.2 1 mil BC® 3.0< Dk< 3.6 1 mil BC®
Inner Layer Line Width/Space 0.005″/0.005″ 0.004″/0.004″ 0.003″/0.0035″
Outer Layer Line Width/Space 0.006″/0.006″ 0.005″/0.005″ 0.004″/0.004″
Impedance (SE or DIFF) 10% 7% 5%
Through Hole Aspect Ratio 14:1 17:1 20:1
Drill Registration (no AR) Drill + 0.010″ Drill + 0.009″ Drill + 0.008″
Blind Vias Layers n to n-1 Layers n to n-2 >Layers n to n-2
Buried Vias No Yes Yes
Sequential Lamination No Yes Yes
Component Type/Pitch 1.0mm BGA 0.8mm BGA 0.65mm BGA

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